Banana Pi BPI-CM5 Pro 8GB Ram 64GB eMMC Compute Module With Rockchip RK3576

$111.44

  • Brand: Banana PI
  • Product Code: bpi-cm5-pro-8gb
  • Availability: In Stock
  • Ex Tax: $111.44

  • 2 or more $109.36
  • 4 or more $107.87

Tags: Banana Pi BPI-CM5 Pro 8GB Ram 64GB eMMC Compute Module With Rockchip RK3576, bpi-cm5-pro-8gb, SBC Boards

Banana Pi BPI-CM5 Pro Compute Module With Rockchip RK3576
Banana Pi BPI-CM5 Pro is a computing module powered by the Rockchip RK3576 second-generation 8nm high-performance AIOT platform. It integrates a quad-core Cortex-A72 @ 2.2GHz and a quad-core Cortex-A53 @ 1.8GHz, along with a dedicated NEON co-processor, a 6 TOPS NPU, and supports up to 16GB of large memory. It supports 4K video encoding and decoding, features a rich set of interfaces, and supports various operating systems.
Key Specifications
SOC: Rockchip RK3576
CPU: Integrates quad-core Cortex-A72 @ 2.2GHz, quad-core Cortex-A53 @ 1.8GHz, and a dedicated NEON co-processor.
GPU: ARM Mali G52 MC3 GPU.
NPU: Up to 6 TOPS (INT8) computing power, supporting INT4/INT8/INT16 mixed precision computation.
VPU/Video Codec:
Decoding: Supports H.264, H.265, VP9, AV1, and AVS2 up to 8K@30fps or 4K@120fps, and high-quality JPEG decoding up to 4K@60fps.
Encoding: Supports H.264 and H.265, JPEG up to 4K@60fps.
RAM: 8GB 32-bit LPDDR5.
Flash: 64GB eMMC.
Operating Voltage: Wide input voltage range from 4.5V to 23V (voltage tolerance ±5%).
Operating Temperature: 0℃ ~ 80℃
Weight: 12g
Dimensions:
CM5: 55 x 40 mm
CM5-IO: 100 x 80 x 29 mm (3.94 x 3.15 x 1.14 inches)

Hardware Specification of Banana Pi BPI-CM5 Pro
CPU
RK3576 Quad-core [email protected] and Quad-core [email protected], 8nm process
GPU
ARM Mali G52 MC3 GPU
Fully compatible with OpenGL ES 1.1, 2.0, and 3.2, OpenCL up to 2.0, and Vulkan 1.1. A dedicated 2D hardware engine with MMU maximizes display performance and provides very smooth operation.
NPU
6 TOPS@INT8
Supports INT4, INT8, INT16, FP16, BF16, and TF32 mixed precision
Supports deep learning frameworks: TensorFlow, Caffe, Tflite, Pytorch, Onnx, NNAndroid NN, etc.
VPU/Codec
Hardware decoding: Supports H.264, H.265, VP9, AV1, and AVS2 up to 8K@30fps or 4K@120fps, and high-quality JPEG decoding up to 4K@60fps.
Hardware encoding: Supports H.264 and H.265, JPEG up to 4K@60fps.
ISP
ISP, 16MP
RAM
8GB 32-bit LPDDR5
Flash
64GB eMMC
Supports MicroSD card expansion
Display
1x HDMI OUT 2.1, supports 4K@120fps
1x MIPI DSI resolution up to 2K@60fps
1x DP 1.4 resolution up to 4K@120fps
Camera
1x 4-Lanes MIPI CSI, up to 2.5 Gbps per lane
1x 2Lanes MIPI CSI, up to 2.5Gbps per lane
Network
1x GMAC provides RGMII/RMII interface
Supports 10/100/1000Mbps data transfer rates
PCIe
2x PCIe 2.0 1-lane
USB
1x USB 3.0
1x USB 2.0
Audio
SPDIF_Tx x1
AUDIO_R/L x1
i2s x1

System Image

Android14

Make your device more personal, protected, and accessible with the newest OS upgrade. Improved photo quality, new themes, and AI-generated wallpapers. Privacy updates for your health, safety, and data. And expanded accessibility features.

Debian Linux

debian12 for BPI-CM5 Pro: Debian 12 brings thousands of new and updated software packages, and supports multiple desktop environments, and processor architectures including 32-bit and 64-bit PC, ARM, MIPS, and PowerPC. However, one of the biggest changes is the upgrade of the Linux kernel from version 5.10 to 6.1 LTS.

Armbian

Armbian is a computing build framework that allows users to create ready-to-use images with working kernels in various user space configurations for various single-board computers. It provides various pre-built images for some supported boards. These are usually Debian or Ubuntu-flavored.

Ubuntu-Rockchip

This project aims to provide a default Ubuntu experience for Rockchip RK3588 devices. Get started today with an Ubuntu Server or Desktop image for a familiar environment.

Supply Declaration

BPI-CM5 Pro will remain in production until at least August 2034.

Notes

ELECTROSTATIC PROTECTION
1. Before handling the device, please ensure you wear an anti-static wrist strap or take electrostatic discharge measures to prevent damage to the development board.
2. Assembly should be performed in an electrostatic-safe environment, avoiding operations in dry and low-humidity conditions.
3. When not in use, store the device in an anti-static bag and keep it in a suitably temperature-controlled, low-humidity environment to prevent static electricity buildup.
4 . When handling the device, avoid friction or collisions to prevent the generation of static electricity that could cause damage. 
5. When holding the device, try to avoid direct contact with the chips on the mainboard to prevent static damage.
6. Do not plug or unplug wires or other devices while the device is operating to avoid damage from electrical surges.
7. When connecting or disconnecting the GPIO/MIPI expansion interfaces, make sure to turn off the power and disconnect the power cable to prevent damage from electrical current.
HEAT MANAGEMENT
Without effective cooling measures, the surface temperature of the main chip may exceed 60 degrees. When handling the device, please avoid direct contact with the SoC and surrounding power inductors to prevent burns. Ensure that the environment is well-ventilated during operation to prevent localized heat buildup, which could lead to overheating. Additionally, do not place the device in direct sunlight. It is recommended to choose between the official cooling fan, heat sink, or third-party cooling kits based on specific usage conditions to ensure optimal cooling performance.

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